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CVE-2017-18297
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52,…
- 7.8HighCVSS base score
- 0.26%Exploitation in 30 daysEPSS · top 82% of all CVEs
- NoKnown exploitednot in CISA's KEV catalog
- NonePublic exploitsnone known yet
Description
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Timeline
ID reserved
By qualcomm
- 4 months later
· 4 months later
Published
- 6 years later
· 6 years later
Record updated
Changes after publication (a new score, a public exploit, EPSS crossing 1, 10 or 50 %, leaving KEV) are kept since November 2026; earlier ones are not known.
Scores
| Scored by | CVSS | Score | Vector |
|---|---|---|---|
| NVDNVD · Modified | 3.0 | High7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
- EPSS (exploitation in 30 days)
- 0.26% · top 82% of all CVEs (11 Nov 2026)
Loading the EPSS history…
The list uses the assigner's score when there is one, then CISA's, then NVD's: High 7.8.
Affected products
Qualcomm, Inc. · Snapdragon Mobile
- affected SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820
References
References3
- https://www.qualcomm.com/company/product-security/bulletins (opens in a new tab)x_refsource_CONFIRMx_transferred
- 1041432 (opens in a new tab)vdb-entryx_refsource_SECTRACKx_transferred
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components (opens in a new tab)x_refsource_CONFIRMx_transferred
Sources
The same CVE in the primary databases and aggregators, to check against.
- CVE.org record (opens in a new tab)
- CVE List JSON (GitHub) (opens in a new tab)
- NVD (opens in a new tab)
- FIRST EPSS (opens in a new tab)
- EUVD EUVD-2017-9423 (opens in a new tab)
- OSV.dev (opens in a new tab)
- GitHub Advisories (opens in a new tab)
- CIRCL Vulnerability-Lookup (opens in a new tab)
Badge for a README or a ticket
[](https://cveledger.app/cve/CVE-2017-18297)Record last updated .